IT Home June 9th news, Lexin Information Technology announced today that the company's first wireless communication chip that supports Wi-Fi 6E has completed engineering sample testing and is scheduled to be officially mass-produced in the second half of 2025. This marks a new breakthrough in the field of high-performance wireless communication chips, officially entering the Wi-Fi 6E high-speed digital communication and transmissive transmission market, and plans to launch a series of products to meet the needs of diversified application.
This chip is equipped with the duocore 500MHz RISC-V developed by Eslite Processor, supports 2 x 2 MU-MIMO and Beamforming, covering 2.4/5/6GHz triple-band Wi-Fi 6/6E.
Official measured data shows that the chip can reach 2.1Gbps in the 5GHz frequency band and 160MHz bandwidth. Equipped with high-speed interfaces such as PCIe, USB, SDIO, etc., it flexibly adapts to a variety of terminal forms.
Relying on the core technology of this chip, Escin will launch multiple specifications of products, focusing on the Wi-Fi 6E high-speed digital communication and transmissive transmission markets, and further expand its product layout in the fields of smart terminals and gateways.
IT Home learned from the Eslite Information Technology announcement that while launching Wi-Fi 6E products, the Eslite team has simultaneously launched the research and development of the next generation of Wi-Fi 7 chips.
Lexin Information Technology stated that the company's Wi-Fi technology gap with top international manufacturers is only one generation and has strong technological competitiveness. The new generation of products will further explore multi-link communication, ultra-high bandwidth and low latency features. As one of the few Wi-Fi chip companies in China that have self-developed core IP, Estimate Technology continues to adhere to technical self-reliance and self-improvement in its products this time: including self-developed Wi-Fi 6E protocol stack, self-developed RISC-V architecture processor and other key modules, further enhancing the product's customization capabilities, technical security and industrial controllability.
